Sahar Jaddi
PhD student
Advanced master in nanotechnology at UCL in 2016

Main project: On a chip fracture mechanics test method
Funding: Assistante
Supervisor(s): Thomas Pardoen

The aim of this research is to develop a new testing method based on an-on-chip concept to measure the fracture toughness of freestanding submicron films. This device consists of two major components, a notched specimen and two actuators. When the test structure is released by etching the sacrificial layer, the two actuators contract, this in turn loads the specimen in traction. In order to define the stress intensity factor expression, which is given by this new model, analytical analysis and finite element simulations must be performed in addition to the experimental part, which is based on the microfabrication techniques. Silicon nitride, silicon oxide and metallic glass thin films will be studied during this work. The major goal of this model is to extract fracture toughness of 2D materials like graphene.

IMMC main research direction(s):
Dynamical and electromechanical systems
Processing and characterisation of materials

finite elements
fracture mechanics
thin films

Research group(s): IMAP
Collaborations: Collaboration ICTEAM Jean-Pierre Raskin


Recent publications

See complete list of publications

Journal Articles

1. Jaddi, Sahar; Coulombier, Michaël; Raskin, Jean-Pierre; Pardoen, Thomas. Crack on a chip test method for thin freestanding films. In: Journal of the Mechanics and Physics of Solids, Vol. 123, p. 267-291 (2019). doi:10.1016/j.jmps.2018.10.005.

Conference Papers

1. Jaddi, Sahar; Coulombier, Michaël; Raskin, Jean-Pierre; Pardoen, Thomas. On a chip fracture mechanics test method.

2. Pardoen, Thomas; Raskin, Jean-Pierre; Coulombier, Michaël; Jaddi, Sahar; Ghidelli, Matteo; Vayrette, Renaud; Idrissi, Hosni. On a chip MEMS based mechanical testing.

3. Pardoen, Thomas; Jaddi, Sahar; Coulombier, Michaël; Idrissi, Hosni; Raskin, Jean-Pierre. Fracture mechanics on a chip.