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IMMC

Sahar Jaddi
PhD student
Advanced master in nanotechnology at UCL in 2016
Contact

Main project: On a chip fracture mechanics test method
Funding: Assistante
Supervisor(s): Thomas Pardoen

The aim of this research is to develop a new testing method based on an-on-chip concept to measure the fracture toughness of freestanding submicron films. This device consists of two major components, a notched specimen and two actuators. When the test structure is released by etching the sacrificial layer, the two actuators contract, this in turn loads the specimen in traction. In order to define the stress intensity factor expression, which is given by this new model, analytical analysis and finite element simulations must be performed in addition to the experimental part, which is based on the microfabrication techniques. Silicon nitride, silicon oxide and metallic glass thin films will be studied during this work. The major goal of this model is to extract fracture toughness of 2D materials like graphene.

IMMC main research direction(s):
Dynamical and electromechanical systems
Processing and characterisation of materials

Keywords:
finite elements
fracture mechanics
micromechanics
thin films

Research group(s): IMAP
Collaborations: Collaboration ICTEAM Jean-Pierre Raskin

    

Recent publications

See complete list of publications

Journal Articles


1. Jaddi, Sahar; Raskin, Jean-Pierre; Pardoen, Thomas. On‑chip environmentally assisted cracking in thin freestanding SiO2 films. In: Journal of Materials Research, Vol. 36, no. 12, p. 2479-2494 (2021). doi:10.1557/s43578-021-00189-3. http://hdl.handle.net/2078.1/245083

2. Jaddi, Sahar; Coulombier, Michaël; Raskin, Jean-Pierre; Pardoen, Thomas. Crack on a chip test method for thin freestanding films. In: Journal of the Mechanics and Physics of Solids, Vol. 123, p. 267-291 (2019). doi:10.1016/j.jmps.2018.10.005. http://hdl.handle.net/2078.1/212157


Conference Papers


1. Jaddi, Sahar; Coulombier, Michaël; Raskin, Jean-Pierre; Pardoen, Thomas. Ténacité et propagation sous-critique de fissure dans les couches minces de dioxyde de silicium et de nitrure de silicium. 2020 xxx. http://hdl.handle.net/2078.1/226251

2. Jaddi, Sahar; Coulombier, Michaël; Idrissi, Hosni; Raskin, Jean-Pierre; Pardoen, Thomas. Fracture toughness and environmentally assisted subcritical cracking of thin freestanding Al2O3 and SiO2 films. 2020 xxx. http://hdl.handle.net/2078.1/237795

3. Jaddi, Sahar; Coulombier, Michaël; Raskin, Jean-Pierre; Pardoen, Thomas. Subcritical crack growth in freestanding silicon nitride and silicon dioxide thin films using residual stress-induced crack on-chip testing technique. In: Nanomechanical Testing in Materials Research and Development VII (ECI Symposium Series), Jon Molina-Aldareguia, IMDEA-Materials Institute, Spain Eds, 2019 xxx. http://hdl.handle.net/2078.1/241274

4. Jaddi, Sahar; Coulombier, Michaël; Raskin, Jean-Pierre; Pardoen, Thomas. Subcritical crack growth in freestanding silicon nitride and silicon dioxide thin films. In: Abstract book - EUROMAT 2019, 2019, p. 1361 xxx. http://hdl.handle.net/2078.1/226316

5. Pardoen, Thomas; Jaddi, Sahar; Coulombier, Michaël; Idrissi, Hosni; Raskin, Jean-Pierre. Fracture mechanics on a chip. 2018 xxx. http://hdl.handle.net/2078.1/214425

6. Jaddi, Sahar; Coulombier, Michaël; Raskin, Jean-Pierre; Pardoen, Thomas. On a chip fracture mechanics test method. 2018 xxx. http://hdl.handle.net/2078.1/204837

7. Pardoen, Thomas; Raskin, Jean-Pierre; Coulombier, Michaël; Jaddi, Sahar; Ghidelli, Matteo; Vayrette, Renaud; Idrissi, Hosni. On a chip MEMS based mechanical testing. 2018 xxx. http://hdl.handle.net/2078.1/214464