Crack-on-chip: a nanomechanical test method to determine the fracture toughness of thin films and 2D materials by Sahar JADDI

For the degree of Doctor of Engineering Sciences and Technology The control and characterization of the fracture behavior of thin films and 2D materials, in the era of continuous device miniaturization, are of paramount importance for the design and integrity assessment of many coatings and microelectronics devices towards more reliable devices.