All electronics and micro/nano technologies publications
icteam | Louvain-la-Neuve
DIAL ICTEAM - Electronics and micro/nano technologies
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Papier de conférenceBoracchi, B., Gkogkos, A., Grzheshchuk, E., Da Silva, S., Huynen, I., Delcorte, A., & Mederos-Henry, F. (2026). The Electrical Chemistry of Historical Oil Paintings: Dielectric properties of aging oil binders, the role of water, and potential links to degradation compound ionic exchange and migration. In na (ed.), Gordon Research Conference (p. 26 p.).
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Article de journalGuo, R., Song, Y., Du, A., Raskin, J.-P., Flandre, D., & Iniguez, B. (2026). Fully Liquid-Metal-Printed SnO₂ Thin-Film Transistors With Al₂O₃ Dielectrics. IEEE Transactions on Electron Devices. Published. https://doi.org/10.1109/TED.2026.3657326 (Original work published 2026)
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Tounsi, F., Flandre, D., Jaziri, N., & et al. (2026). Hybrid LTCC–Polyimide Approach for High-Sensitivity Mechanical Sensing Applications. Sensors, 26(5). https://doi.org/10.3390/s26051419 (Original work published 2026)
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Anna Furberg, Shoaib Azizi, Jan Bieser, Bol, D., Vlad Coroamă, Elina Eriksson, Francesco Fuso-Nerini, Golard, L., Mattias Höjer, George Kamiya, Dag Lundén, Nina Lövehagen, Jens Malmodin, Daniel Schien, & Göran Finnveden. (2026). Guidelines for assessments of the global information and communication technology sector’s direct energy use and climate impact: Key aspects and future scenarios. Renewable & Sustainable Energy Reviews, 226(1), 116176. https://doi.org/10.1016/j.rser.2025.116176 (Original work published 2026)
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Ratier, T., Van Brandt, L., Bidoul, N., Delvenne, J.-C., & Flandre, D. (2026). Stochasticity-aware modeling methodology of mott memristors validated on vanadium dioxide devices. Engineering Research Express, 8(3). https://doi.org/10.1088/2631-8695/ae36ef (Original work published 2026)
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Nasr, D., Flandre, D., Tounsi, F., & et al. (2026). A MEMS Variable Reluctance Sensor for Contactless Detection of a Ferrous Rotating Target. Sensors, 26(4). https://doi.org/10.3390/s26041280 (Original work published 2026)
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Golard, L., Dethienne, R., Louveaux, J., & Bol, D. (2026). A parametric life-cycle model for assessing environmental impacts of 4G and 5G cellular base stations. The International Journal of Life Cycle Assessment, 31. https://doi.org/10.1007/s11367-026-02597-1 (Original work published 2026)
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Chapitre de livreSidi Salah, L., Danlée, Y., Francis, L., & Huynen, I. (2026). Recent applications of biopolymer nanocomposites in biodegradable electronics. In Muhammad Moniruzzaman, A. Vijaya Bhaskar Reddy (ed.) (ed.), Polymer and Biopolymer Nanocomposites. Elsevier.
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Article de journalLong Chen, Liting Liu, Hongfu Li, Xingqiang Liu, Yuan Liu, Raskin, J.-P., Flandre, D., & Li, G. (2025). Mechanisms of forward current transport in vertical nanoscale devices: insights and applications. Nano Express, 6(1). https://doi.org/10.1088/2632-959X/ad9853 (Original work published 2025)
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Khamis, A., Urbanczyk, L., Detrambleur, C., & Huynen, I. (2025). Sub-Terahertz Absorption Shielding Performances of Polyurethane - Carbon Nanotubes composite Foams. Materials Research Bulletin, 25 p. https://doi.org/10.1016/j.materresbull.2025.113793 (Original work published 2025)
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Gilson I. Wirth, Thiago H. Both, Mauricio B. Silva, & Van Brandt, L. (2025). Statistical Modeling of Timing Variability due to Random Telegraph Noise in Logic Gates. Fluctuation and Noise Letters. Submitted. https://doi.org/10.1142/S021947752540022X (Original work published 2025)
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Flandre, D., Brammertz, G., Scaffidi, R., & et al. (2025). Investigation of Recombination Mechanisms in Electronic Devices Using Bias-dependent Admittance Spectroscopy Applied to CIGS Solar Cells. ACS Applied Materials & Interfaces, 17(33), 46998-47008. https://doi.org/10.1021/acsami.5c09671 (Original work published 2025)
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Zeidi, N., Gabbouj, R., Raskin, J.-P., Tounsi, F., & Flandre, D. (2025). High-Resistivity Trap-Rich Silicon Substrate Advantages for Large Integrated MIM Capacitors. IEEE Transactions on Electron Devices, 1-7. https://doi.org/10.1109/TED.2025.3622098 (Original work published 2025)
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Zeidi, N., Tounsi, F., Raskin, J.-P., & Flandre, D. (2025). Vialess non-spiral on-chip stacked transformer on high-resistivity silicon for improved RF power transfer efficiency. Microelectronic Engineering, 302, 112424. https://doi.org/10.1016/j.mee.2025.112424 (Original work published 2026)
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Lahaye, L., Roisin, N., André, N., Flandre, D., & Raskin, J.-P. (2025). Design, Fabrication, Modeling and Characterization of a Polyimide-Based Membrane for High Strain Studies in Microfabricated Devices. IEEE Transactions on Semiconductor Manufacturing, 3, 26-33. https://doi.org/10.1109/TMAT.2025.3557763 (Original work published 2025)
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Lefebvre, M., & Bol, D. (2025). MANTIS: A Mixed-Signal Near-Sensor Convolutional Imager SoC Using Charge-Domain 4b-Weighted 5-to-84-TOPS/W MAC Operations for Feature Extraction and Region-of-Interest Detection. IEEE Journal of Solid State Circuits, 60(3), 934-948. https://doi.org/10.1109/JSSC.2024.3484766 (Original work published 2025)
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Rack, M., Lederer, D., & Raskin, J.-P. (2025). High-Resistivity Substrates in 22-nm FD-SOI—Part I: Wideband Modeling and Impact on RF Losses. IEEE Transactions on Electron Devices, 72(9), 5229-5235. https://doi.org/10.1109/TED.2025.3594268 (Original work published 2025)
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Lefebvre, M., & Bol, D. (2025). A nA-Range Area-Efficient Sub-100-ppm/°C Peaking Current Reference Using Forward Body Biasing in 0.11-µm Bulk and 22-nm FD-SOI. IEEE Journal of Solid State Circuits, 60(2), 579-592. https://doi.org/10.1109/jssc.2024.3406423 (Original work published 2025)
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Roisin, N., Lahaye, L., Raskin, J.-P., & Flandre, D. (2025). Electron mobility in silicon under high uniaxial strain. Solid-State Electronics, 227. https://doi.org/10.1016/j.sse.2025.109118 (Original work published 2025)
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Long Chen, Zheyi Lu, Yu Song, Runtong Guo, Hongfu Li, Raskin, J.-P., Flandre, D., Yuan Liu, Lei Liao, & Li, G. (2025). Quantum capacitance impact on low-frequency noise in MoS2 transistors. Physical Review Applied, 23(5), 54012. https://doi.org/10.1103/PhysRevApplied.23.054012 (Original work published 2025)
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Guven, I., Parlak, M., Lederer, D., & De Vleeschouwer, C. (2025). AI-Driven Integrated Circuit Design: A Survey of Techniques, Challenges, and Opportunities. I E E E Access, 13, 167364-167389. https://doi.org/10.1109/ACCESS.2025.3607865 (Original work published 2025)
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Ma, S., André, N., Tuyaerts, R., Francis, L., Raskin, J.-P., & Lederer, D. (2025). Porous Silicon Waveguides for Integrated Sub-THz Systems. IEEE Microwave and Wireless Technology letters. Published. https://doi.org/10.1109/LMWT.2025.3643128 (Original work published 2025)
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Gomeniuk Y V, Lytvyn P M, Gomeniuk Y Y, Rudenko T E, Vasin A V, Rusavsky A V, Lysenko V S, Kilchytska, V., Flandre, D., & Nazarov A N. (2025). Charge transport and charge trapping in polycrystalline ZnO thin films doped by methane: local and integrated analysis. Physica Scripta : an international journal for experimental and theoretical physics, 100(2). https://doi.org/10.1088/1402-4896/ada4ea (Original work published 2025)
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Sidi Salah, L., Gabriela Berkowicz-Płatek, Witold Z˙ ukowski, Danlée, Y., Huynen, I., Kinga Wencel, & et al. (2025). Combustion of Polycarbonate and Polycarbonate–Carbon Nanotube Composites Using Fluidized Bed Technology. Energies, 18, 1833. https://doi.org/10.3390/ en18071833 (Original work published 2025)
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Chen, Q., Van Brandt, L., Kilchytska, V., Bestelink, E., Sporea, R. A., & Flandre, D. (2025). Low-frequency noise in polysilicon Source-Gated Thin-Film transistors. Solid-State Electronics, 109099. https://doi.org/10.1016/j.sse.2025.109099 (Original work published 2025)
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Lahaye, L., Roisin, N., André, N., Flandre, D., & Raskin, J.-P. (2025). Design, Fabrication, Modelling and Characterization of a Polyimide-Based Membrane for High Strain Studies in Microfabricated Devices. IEEE Transactions on Materials for Electron Devices, 2, 26-33. https://doi.org/10.1109/TMAT.2025.3557763 (Original work published 2025)
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Kotagama Virendra, Renz Arne Benjamin, Melnyk Kyrylo, Kilchytska, V., Flandre, D., & Shah V.A. (2025). Total Ionising Dose effects in commercial 4H-SiC MOSFETs. IEEE Transactions on Nuclear Science, 1. https://doi.org/10.1109/TNS.2025.3645913 (Original work published 2025)
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Nyssens, L., Nabet, M., Rack, M., Bendou, Y., Wane, S., Sombrin, J. B., Raskin, J.-P., & Lederer, D. (2025). Analysis of Back-Gate Bias Control on EVM Measurements of a Dual-Band Power Amplifier in 22 nm FD-SOI for 5G 28 and 39 GHz Applications. IEEE Transactions on Circuits and Systems I, 72(2), 753-762. https://doi.org/10.1109/TCSI.2024.3487636 (Original work published 2025)
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Bendou, Y., Lederer, D., Cathelin, A., & Raskin, J.-P. (2025). High-resistivity silicon to reduce substrate noise coupling in 28 nm FD-SOI VCOs. International Journal of Microwave and Wireless Technologies. Submitted. https://doi.org/10.1017/S1759078725101876 (Original work published 2025)
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Tyagulski, I. P., Gudymenko, O. Yo., Rusavsky, A. V., Tiagulskyi, S. I., Flandre, D., & et al. (2025). Flash lamp annealing of Cu(In1–xGax)SSe films deposited on polyimide substrate: Crystalline structure and chemical composition. Fizika Napivprovidnikiv Kvantova ta Optoelektronika, 28(2), 232-238. https://doi.org/10.15407/spqeo28.02.232 (Original work published 2025)
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Song Yu, Runtong Guo, Ruohao Hong, Rui He, Xuming Zou, Benjamin Iñiguez, Flandre, D., Lei Liao, & Li, G. (2025). Improving electrical performance and fringe effect in p-type SnOx thin film transistors via Ta incorporation. Journal of Semiconductors, 46(9). https://doi.org/10.1088/1674-4926/25010031 (Original work published 2025)
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Klauner, T., Roisin, N., Bonfanti, O., Sabri Alirezaei, I., André, N., & Flandre, D. (2025). Radiation Degradation and Mitigation of an Ultrathin SOI SPAD Using a Perimeter Gate. IEEE Transactions on Electron Devices, 72(4), 1844-1850. https://doi.org/10.1109/TED.2025.3543789 (Original work published 2025)
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Rack, M., Lederer, D., & Raskin, J.-P. (2025). High-Resistivity Substrates in 22-nm FD-SOI—Part II: Impact on mm-Wave SPDT Performance. International Journal of Microwave and Wireless Technologies, 72(9), 5236-5242. https://doi.org/10.1017/S1759078725101876 (Original work published 2025)
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Khamis, A., & Huynen, I. (2025). The Impact of Pore Diameters, Pore Randomness, and Void Fraction on the EMI Shielding of Polyurethane Foams. International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 38(6), e70111. https://doi.org/10.1002.jnm.70111 (Original work published 2025)
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Flandre, D., Raskin, J.-P., Hong, R., & et al. (2025). Symmetrical Ambipolar Transport in SnO Thin-Film Transistors Enabled by Dopant-Induced Preferential Crystal Orientation toward Complementary Logic. Nano Letters, 25(43), 15698-15704. https://doi.org/10.1021/acs.nanolett.5c04300 (Original work published 2025)
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Khamis, A., Urbanczyk, L., Detrembleur, C., & Huynen, I. (2025). Effects of carbon nanotubes on the AC conductivity, permittivity, and electromagnetic shielding performance of polyurethane foams in the 15 Hz – 26.5 GHz frequency range. Journal of Materials Science: Materials in Electronics. Published. (Original work published 2025)
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Zeng, X., André, N., Masarweh, E., Bonfanti, O., & Flandre, D. (2025). Electromechanical Measurements and Modeling of a High-Performance Small-Area Ultra-Thin SOI MEMS Piezoresistive Pressure Sensor. IEEE Transactions on Instrumentation and Measurement, 74(7507509), 1-9. https://doi.org/10.1109/TIM.2025.3566836 (Original work published 2025)
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Michele Bonnin, Van Brandt, L., Delvenne, J.-C., Fabio L. Traversa, & Fabrizio Bonani. (2025). A Thermodynamically Consistent Thermal Equilibrium Gaussian White Noise Model for Nonlinear Resistors. IEEE Transactions on Circuits and Systems I: Regular Papers, 1-13. https://doi.org/10.1109/TCSI.2025.3639450 (Original work published 2025)
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Zeidi, N., Tounsi, F., Raskin, J.-P., & Flandre, D. (2025). Trap-rich high-resistivity silicon for improved on-chip monolithic transformers characteristics. Solid-State Electronics, 230. https://doi.org/10.1016/j.sse.2025.109261 (Original work published 2025)
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Gevers, C., Lejeune, L., Masarweh, E., Hermans, S., & Francis, L. (2025). Freestanding Porous Silicon Membranes for Sensing Enabled by Flow-Through Decoration of Gold Nanoparticles. ACS Applied Nano Materials, 8(44), 21285-21293. https://doi.org/10.1021/acsanm.5c03632 (Original work published 2025)
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Van Brandt, L., Bonnin, M., Banaszeski da Sila, M., Bolcato, P., Wirth, G. I., & Flandre, D. (2025). Modeling and Predicting Noise-Induced Failure Rates in Ultra-Low-Voltage SRAM Bitcells Affected by Process Variations. IEEE Transactions on Circuits and Systems Part 1: Regular Papers, 72(34), 989-1002. https://doi.org/10.1109/TCSI.2024.3525387 (Original work published 2025)
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Papier de conférenceVan Brandt, L., Bidoul, N., Ratier, T., Brandsteert, G., Delvenne, J.-C., Zeng, X., & Flandre, D. (2025). Temperature-Sensitive Spiking Neurons Implemented with Microfabricated Vanadium Dioxide Memristors. IEEE EDS Mini-Colloquium FET100 - Emerging Solutions Toward Sustainable Electronics: From Concept To Implementation, Siania (Roumanie).
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Brandsteert, G., Van Brandt, L., & Flandre, D. (2025). Reliability Analyses of Ultra-Low Voltage Analog Spiking Neurons. 025 32nd International Conference on Mixed Design of Integrated Circuits and System (MIXDES), p. 156-160. https://doi.org/10.23919/MIXDES66264.2025.11092240
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Favresse, S., Maistriaux, P., Harpe, P., Flandre, D., & Bol, D. (2025). An Ultra-Low-Power Dual-Channel Analog Front End for Vagus Nerve Sensing with Chopping-Minimized Gain Mismatch. 2025 IEEE Biomedical Circuits and Systems Conference (BioCAS), 121-125. https://doi.org/10.1109/BioCAS67066.2025.00036 (Original work published 2025)
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Rack, M., Wane, S., Bajon, D., Raskin, J.-P., & Lederer, D. (2025). Low Power K- and Ka- Wideband LNA Design in 22 nm FD-SOI Using Transformer-Tuned Input. 2025 IEEE 24th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), 8-11. https://doi.org/10.1109/SiRF63957.2025.11076816 (Original work published 2025)
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Struyf, A., Ismaili, N., De Doncker, P., Lederer, D., & Quitin, F. (2025). Hybrid Beamforming for Satellite Ground Stations in the mmWave Band. 2025 19th European Conference on Antennas and Propagation (EuCAP), p. 1-5. https://doi.org/10.23919/EuCAP63536.2025.10999975
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Nasr, D., Bau, M., Nastro, A., Bertelli, S., Ferrari, M., Said, M. H., Flandre, D., Mansour, M., Tounsi, F., & Ferrari, V. (2025). MEMS Variable Reluctance Sensor Based on a Micromachined Coil. Sensors and Microsystems. AISEM 2025. Lecture Notes in Electrical Engineering, p. 164-169. https://doi.org/10.1007/978-3-032-08271-8_26
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Masarweh, E., & Flandre, D. (2025). Mechanical Characterization of Fully Flexible Polyimide Membrane-Substrate Integration. Measuring By Light (MBL2025), Liège, Belgium.
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Ozturk, O., Zeidi, N., Tounsi, F., Flandre, D., & Murat Kaya Yapici. (2025). Modeling and Lumped-Element Extraction of PCB-Based Laterally Coupled Coplanar Transformers. 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and M. Published. 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and, Utrecht, Netherlands. https://doi.org/10.1109/EuroSimE65125.2025.11006563 (Original work published 2025)
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Gabbouj, R., Zeidi, N., Flandre, D., & Tounsi, F. (2025). Single- versus Double-layer Spiral Inductor on High-Resistivity Trap-Rich Silicon Substrate. 2025 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 1-6. https://doi.org/10.1109/DTIP66728.2025.11099177 (Original work published 2025)
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Van Brandt, L., Brandsteert, G., Bidoul, N., Ratier, T., Zeng, X., Delvenne, J.-C., & Flandre, D. (2025). Excitability of Analog Spiking Neurons. GdR BioComp, Aussois (France).
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Delait, L., Craeye, C., Raskin, J.-P., & Lederer, D. (2025). Analytical Expressions for Antenna On-Chip Efficiency at mm-Wave and Sub-THz Frequencies. 2025 55th European Microwave Conference (EuMC), p. 930-933. https://doi.org/10.23919/EuMC65286.2025.11235230
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Yadav, S., Rassekh, A., Cardinael, P., Banerjee, S., Esfeh, B. K., Peralagu, U., Dehan, M., Raskin, J.-P., & Parvais, B. (2025). High Linearity and Low RF Loss GaN-on-Si Substrates Achieved Through Interface Engineering. IEEE Compound Semiconductor Integrated Circuit Symposium. Technical Digest, N.A.(N.A.), N. https://doi.org/10.1109/bcicts63111.2025.11211364 (Original work published 2025)
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Zardi, N., Shirin, A., Masmoudi, M., Danlée, Y., Tounsi, F., & Flandre, D. (2025). Cupric Oxide-Coated PCB-based Interdigitated Transducer for Acetone Sensing. 2025 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP). Published. 2025 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), Split, Croatia. https://doi.org/10.1109/DTIP66728.2025.11099216 (Original work published 2025)
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Van Brandt, L., Bidoul, N., Ratier, T., Brandsteert, G., Delvenne, J.-C., Zeng, X., & Flandre, D. (2025). Temperature-Sensitive Spiking Neurons Implemented with Microfabricated Vanadium Dioxide Memristors. IEEE EDS Mini-Colloquium FET100 - Emerging Solutions Toward Sustainable Electronics: From Concept To Implementation, Edimbourg (UK).
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Ozturk, O., Tounsi, F., Francis, L., Flandre, D., & Murat Kaya Yapici. (2025). Multiphysics Modeling of a Novel MEMS Accelerometer Based on Electromagnetic Induction. 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and M. Published. 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and M, Utrecht, Netherlands. https://doi.org/10.1109/EuroSimE65125.2025.11006620 (Original work published 2025)
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Masrouri, A., Courte, Q., Raskin, J.-P., & Lederer, D. (2025). Influence of RF Probe Tip Geometry on Surface Wave Generation in Millimeter-Wave on-Wafer Characterization. 2025 55th European Microwave Conference (EuMC), p. 584-587. https://doi.org/10.23919/EuMC65286.2025.11235136
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Chapitre de livreHuynen, I. (2025). Microwave Absorption and Shielding Mechanisms in Micro-cellular Foamed Conductive Composites. In Khalid Mujasam Batoo (ed.) (ed.), New Horizons of Science, Technology and Culture. BP International. https://doi.org/10.9734/bpi/nhstc/v4/6070
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Article de journalGauthier Roussilhe, Pirson, T., Mathieu Xhonneux, & Bol, D. (2024). From silicon shield to carbon lock-in? The environmental footprint of electronic components manufacturing in Taiwan (2015–2020). Journal of Industrial Ecology, 28(5), 1212-1226. https://doi.org/10.1111/jiec.13487 (Original work published 2024)
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Kaschten, V., Tihon, D., Lederer, D., & Craeye, C. (2024). Mismatched Luneburg lenses: numerical analysis and design rules. IEEE Transactions on Antennas and Propagation, 72(5), 4487-4500. https://doi.org/10.1109/TAP.2024.3376725 (Original work published 2024)
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Sinda Kaziz, Pietro Romano, Giovanni Artale, Giuseppe Rizzo, Fabio Viola, Guido Ala, Flandre, D., Tounsi, F., Antonino Imburgia, & et al. (2024). Printed-Board Inductive Loop Topologies Performance for Partial Discharges Detection. IEEE Transactions on Industry Applications, 60(4). https://doi.org/10.1109/TIA.2024.3384134 (Original work published 2024)
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Kotagama, V., Renz, A. B., Kilchytska, V., Flandre, D., Qi, Y., Shah, V. A., Antoniou, M., & Gammon, P. M. (2024). Investigations into the Impact of Deposition or Growth Techniques on the Field Oxide TID Response for 4H-SiC Space Applications. Solid State Phenomena, 362, 83-88. https://doi.org/10.4028/p-4px5zX (Original work published 2024)
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Huang, Y., Yan, Y., Nabet, M., Liu, F., Li, B., Li, B., Han, Z., Cristoloveanu, S., & Raskin, J.-P. (2024). Analysis of anomalous C-V behavior for extracting the traps density in the undoped polysilicon with a double-BOX structure. Solid-State Electronics, 217(n/), 108946. (Original work published 2024)
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Cardinael, P., Yadav, S., Hahn, H., Zhao, M., Banerjee, S., Kazemi Esfeh, B., Mauder, C., O’Sullivan, B., Peralagu, U., Vohra, A., Langer, R., Collaert, N., Parvais, B., & Raskin, J.-P. (2024). AlN/Si interface engineering to mitigate RF losses in MOCVD-grown GaN-on-Si substrates. Applied Physics Letters, 125(7), 2103. https://doi.org/10.1063/5.0212145 (Original work published 2024)
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Cardinael, P., Yadav, S., Rack, M., Peralagu, U., Alian, A., Parvais, B., Collaert, N., & Raskin, J.-P. (2024). Contribution of Substrate Harmonic Distortion to GaN-on-Si RF Switches Linearity. IEEE Microwave and Wireless Technology Letters, 34(3), 298-301. https://doi.org/10.1109/lmwt.2024.3355148 (Original work published 2024)
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Masarweh, E., Arseenko, M., Guaino, P., & Flandre, D. (2024). Membrane-based mechanical characterization of screen-printed inks: Deflection analysis of ink layers on polyimide membranes. Applied Research. Published. https://doi.org/10.1002/appl.202300113 SECTIONS (Original work published 2024)
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Hong, R., He, P., Zhang, S., Hong, X., Tian, Q., Liu, C., Bu, T., Su, W., Li, G., Flandre, D., & et al. (2024). Compositional Engineering of Cu-Doped SnO Film for Complementary Metal Oxide Semiconductor Technology. Nano Letters : a journal dedicated to nanoscience and nanotechnology, 24(4), 1176-1183. https://doi.org/10.1021/acs.nanolett3c03953 (Original work published 2024)
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Lefebvre, M., & Bol, D. (2024). A 2.5-nA Area-Efficient Temperature-Independent 176-/82-ppm/°C CMOS-Only Current Reference in 0.11-µm Bulk and 22-nm FD-SOI. IEEE Journal of Solid State Circuits, 59(11), 3752-3766. https://doi.org/10.1109/jssc.2024.3402960 (Original work published 2024)
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Parion, J., Scaffidi, R., Duerinckx, F., Sivaramakrishnan, H., Flandre, D., Poortmans, J., & Vermang, B. (2024). Comparative study of the interface passivation properties of LiF & Al2O3 using silicon MIS capacitor. Applied Physics Letters, 124(14), 142901. https://doi.org/10.10363/5.0203484 (Original work published 2024)
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Bidoul Noemie, Roisin, N., & Flandre, D. (2024). Tuning the Intrinsic Stochasticity of Resistive Switching in VO2 Microresistors. Nano Letters : a journal dedicated to nanoscience and nanotechnology, 24(21), 6201-6209. https://doi.org/10.1021/acs.nanolett.4c00184 (Original work published 2024)
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Cardinael, P., Yadav, S., Parvais, B., & Raskin, J.-P. (2024). Effect of Buffer Charge Redistribution on RF Losses and Harmonic Distortion in GaN-on-Si Substrates. IEEE Journal of the Electron Devices Society, 12, 322-330. https://doi.org/10.1109/JEDS.2024.3386170 (Original work published 2024)
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Papier de conférenceNabet, M., Rack, M., Crémer, S., Paillardet, F., Cathelin, A., Raskin, J.-P., & Lederer, D. (2024). Sub-6 GHz RF SPDT Switches Designed in an Advanced 28 nm Fully-Depleted Silicon-on-Insulator Technology with a High Resistivity Substrate. 2024 19th European Microwave Integrated Circuits Conference (EuMIC). Published. 2024 19th European Microwave Integrated Circuits Conference (EuMIC), Paris, France. https://doi.org/10.23919/EuMIC61603.2024.10732828
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Rack, M., Nyssens, L., Wane, S., Bajon, D., Raskin, J.-P., & Lederer, D. (2024). A Low-Power 42 to 67 GHz Variable-Gain LNA in 22FDX. 2024 19th European Microwave Integrated Circuits Conference (EuMIC), p. 367-370. https://doi.org/10.23919/EuMIC61603.2024.10732188
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Bendou, Y., Rack, M., Lederer, D., cathelin, A., & Raskin, J.-P. (2024). Substrate noise mitigation using high resistivity base silicon wafer for a 14 GHz VCO on 28 nm FD-SOI. 2024 19th European Microwave Integrated Circuits Conference (EuMIC), 355-358. https://doi.org/10.23919/EuMIC61603.2024.10732151
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Vanhouche, B., Cardinael, P., Boakes, L., Ragnarsson, L.-Å., Rolin, C., Raskin, J.-P., & Parvais, B. (2024). Environmental Analysis of RF Substrates. 2024 Electronics Goes Green 2024+ (EGG), 1-8. https://doi.org/10.23919/egg62010.2024.10631181 (Original work published 2024)
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Chouaibi, S., Said Hadj, M., Imburgia, A., Romano, P., Kaziz, S., Ala, G., Ben Ayed, M., Flandre, D., & Tounsi, F. (2024). Inductive Loop Operation Versus Loop Antenna for Partial Discharge Detection. 2024 IEEE 5th International Conference on Dielectrics (ICD), 1-4. https://doi.org/10.1109/ICD59037.2024.10613039 (Original work published 2024)
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Bidoul Noemie, Pauline Raux, Van Aerschot, T., Alex Pip, Renaux, C., Faniel, S., Flandre, D., & Raskin, J.-P. (2024). Process-Based Life Cycle Assessment of a Vanadium Dioxide Spiking Neuron. 2024 Electronics Goes Green 2024+ (EGG). Published. 2024 Electronics Goes Green 2024+ (EGG), Berlin, Germany. https://doi.org/10.23919/EGG62010.2024.10631188
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Lefebvre, M., & Bol, D. (2024). A Mixed-Signal Near-Sensor Convolutional Imager SoC with Charge-Based 4b-Weighted 5-to-84-TOPS/W MAC Operations for Feature Extraction and Region-of-Interest Detection. Proceedings of the 2024 IEEE Custom Integrated Circuits Conference (CICC), 1-2. https://doi.org/10.1109/CICC60959.2024.10528961 (Original work published 2024)
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Golard, L., Agram, Y., Rottenberg, F., Quitin, F., Bol, D., & Louveaux, J. (2024). A Parametric Power Model of Multi-Band Sub-6 GHz Cellular Base Stations Using On-Site Measurements. IEEE International Symposium Personal, Indoor and Mobile Radio Communications. Published. 2024 IEEE 35th Annual International Symposium on Personal, Indoor and Mobile Radio Communications (PIMRC), Valencia, Spain. https://doi.org/10.1109/PIMRC59610.2024.10817448 (Original work published 2024)
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Favresse, S., Bol, D., & Flandre, D. (2024). A 1.88-NEF 3-kHz Current-Reuse Common-Gate Amplifier Featuring Resistorless High-Pass Filtering. Proceedings of the 2024 31st IEEE International Conference on Electronics, Circuits and Systems (ICECS). Published. IEEE International Conference on Electronics, Circuits and Systems (ICECS), Nancy, France. https://doi.org/10.1109/ICECS61496.2024.10848910 (Original work published 2024)
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Perrosé, M., Acosta Alba, P., Reboh, S., Lugo, J., Plantier, C., Cardinael, P., Rack, M., Allibert, F., Milesi, F., Garros, X., & Raskin, J.-P. (2024). Local Interface RF Passivation Layer Based on Helium Ion-Implantation in High-Resistivity Silicon Substrates. Proceedings of the 2024 IEEE/MTT-S International Microwave Symposium (IMS)., 944-947. https://doi.org/10.1109/IMS40175.2024.10600220 (Original work published 2024)
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Chapitre de livrePirson, T., Le Brun, G., Ernesto Quisbert-Trujillo, Thomas Ernst, Raskin, J.-P., & Bol, D. (2024). Towards Life Cycle Thinking and Judicious Ecodesign for the Internet of Things (IoT) Current Practices and Perspectives. In Jenny Stanford Publishing (ed.), Outlooking beyond Nanoelectronics and Nanosystems (Ultra Scaling, Pervasiveness, Sustainable Integration, and Biotic Cross-Inspiration (1st Edition), p. p. 75-136). Simon Deleonibus. https://doi.org/10.1201/9781003509905
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